特点FEATURES

◆Low threshold current

◆High optical power

◆Integrated Low Power TEC chip

◆High reliability

◆With independent patent technology

适用于APPLICATION

◆oxic gas detection

◆Opticalinstruments

◆Etc.

Parameters RATING

Part No. HEXX

Storage Temperature -40°C ~ + 85°C

Operating Temperature -20°C ~ +65°C

Lead Soldering Duration 10sec(Max)

Laser Diode Forward Current 100mA(Max)

Lead Soldering Temperature 260°C(Max)

TEC Current 1.2A(Max)

Photodiode reverse current 5mA